SMT reflow soldering requires the use of soldering paste to core the electronic devices to be soldered onto the printed circuit board. After heating, the solder material in the solder joint is melted and re flowable, wetting the solder joint and producing welding after cooling. Therefore, the electronic devices are soldered to the destination of the printed circuit board. What is the entire production process of SMT reflow soldering furnace like? Let's share it here with Northrend.

1、 Template: the first PCB production and processing template based on the design. General templates are divided into corroded (also known as etching processing) copper templates or stainless steel plate templates (cheap, suitable for small batch production and experimentation, and chip pin spacing>0.65mm); Laser cutting of stainless steel templates (high precision, expensive, suitable for large-scale, automated production lines, and 0.3mm ≤ chip pin spacing ≤ 0.5mm).

2、 Leak printing: Its function is to use a scraper to leak the solder paste onto the solder layer of the PCB, preparing for the installation of the device. The selected machine equipment is an SMT mounting machine (fully automatic, semi-automatic SMT mounting machine) or a manual screen printing ink table, scraper (stainless steel plate or plastic), located at the forefront of the SMT production line equipment.

3、 Chip mounting: Its function is to accurately install surface mount technology electronic devices on the fixed points of the PCB. The selected machine equipment is the SMT SMT mounting machine (fully automatic, fully automatic or manual), vacuum suction pen or specialized medical tweezers, located behind the silk screen printing machine in the SMT production line.

4、 Reflow soldering: Its function is to melt the soldering paste, making the surface mount technology electronic devices and PCB firmly welded together to achieve the electrical characteristics specified in the design plan and strictly follow the national standard curve diagram for high-precision operation. The selected machine equipment is a reflow soldering furnace (automatic infrared/warm air reflow soldering furnace), located behind the SMT SMT SMT SMT placement machine in the production line.

5、 Cleaning: Its function is to remove substances that affect electrical performance or harmful welding residues such as solder paste from the edges of PCBs with better mounting. If cleaning free welding materials are used, it is generally not necessary to clean them. The commonly used cleaning machines and equipment are ultrasonic cleaners and specialized cleaning liquids, which can be fixed or not online.

6、 Inspection: Its function should be to inspect the installation quality and weld quality of PCBs with better mounting quality. Commonly used equipment includes high-power magnifying glass, optical microscope, online testing instrument (ICT), flying needle tester, machine vision inspection instrument (AOI), X-RAY monitoring system, action detection instrument, etc. The parts must be inspected and equipped at appropriate positions on the production line.

7、 Repair: Its function should be to inspect the abnormal PCB and carry out repair and repair. Use software for electric soldering irons, maintenance work platforms, etc. At the same time, the Nuoxinde reflow soldering furnace can also be used for adjustment and non-destructive maintenance. Equipped in random parts of the production line. Detailed introduction to the principle and production process of reflow soldering furnace